Ieee Transactions On Components Packaging And Manufacturing Technology
- 期刊全稱:Ieee Transactions On Components Packaging And Manufacturing Technology
- 簡稱:IEEE T COMP PACK MAN
- ISSN:2156-3950
- ESSN:2156-3950
- 研究方向:ENGINEERING, MANUFACTURING - ENGINEERING, ELECTRICAL & ELECTRONIC
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2023最新分區
Ieee Transactions On Components Packaging And Manufacturing Technology英文簡介
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Ieee Transactions On Components Packaging And Manufacturing Technology中文簡介
《Ieee Transactions On Components Packaging And Manufacturing Technology》是一本由Institute of Electrical and Electronics Engineers Inc.出版商出版的專業工程技術期刊,該刊創刊于2011年,刊期12 issues/year,該刊已被國際權威數據庫SCI、SCIE收錄。在中科院最新升級版分區表中,該刊分區信息為大類學科:工程技術 3區,小類學科:工程:電子與電氣 3區;材料科學:綜合 3區;工程:制造 4區;在JCR(Journal Citation Reports)分區等級為Q3。該刊發文范圍涵蓋工程:電子與電氣等領域,旨在及時、準確、全面地報道國內外工程:電子與電氣工作者在該領域取得的最新研究成果、工作進展及學術動態、技術革新等,促進學術交流,鼓勵學術創新。2021年影響因子為1.922,平均審稿速度一般,3-6周。
中科院分區最新升級版(當前數據版本:2021年12月最新升級版)
大類學科 |
分區 |
小類學科 |
分區 |
Top期刊 |
綜述期刊 |
工程技術 |
3區 |
ENGINEERING, ELECTRICAL & ELECTRONIC
工程:電子與電氣
MATERIALS SCIENCE, MULTIDISCIPLINARY
材料科學:綜合
ENGINEERING, MANUFACTURING
工程:制造
|
3區
3區
4區
|
否 |
否 |
JCR分區(當前數據版本:2021-2022年最新版)
JCR分區等級 |
JCR所屬學科 |
分區 |
影響因子 |
Q3 |
ENGINEERING, ELECTRICAL & ELECTRONIC |
Q3 |
1.922 |
ENGINEERING, MANUFACTURING |
Q4 |
MATERIALS SCIENCE, MULTIDISCIPLINARY |
Q4 |
期刊指數
影響因子 |
h-index |
Gold OA文章占比 |
研究類文章占比 |
OA開放訪問 |
平均審稿速度 |
1.922 |
39 |
4.24% |
97.82% |
未開放 |
一般,3-6周 |
IF值(影響因子)趨勢圖